Liquid and Dry Film Resists for Advanced Packaging 应用程序

北京PK赛车网站电子 & Imaging offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s advanced wafer level packaging, 微机电系统, and 3D photolithography applications.

Designed to prevent metals from leaching into the photoresists, they are compatible with plating chemistries in a variety of metals including copper, 纯锡, 和镍. Our chemically-amplified and conventional formulations in both dry and liquid photoresist versions feature:

  • Excellent resolution for high aspect ratio
  • Excellent conformal properties
  • 30-80 µm thickness coverage range
  • Easy removal after plating

Liquid Bump 光阻

Liquid photoresists are best suited to wafer-level processes. They are spin-coated, baked, exposed, developed, and then stripped.


  • Intervia™ BCPR-i 4500
  • 皮普BPR™100

Dry Bump 光阻

Dry bump photoresists are suited to applications requiring thicker films. They are also better choice than liquid for panel-level packaging.


  • 巨头系列
  • WBR和WB系列
  • MX系列
  • Bump plating photoresist technology was developed to meet today’s requirement of tighter bump pitches for advanced wafer level packaging processes as the semiconductor industry moves from plating bumps to smaller pillars.

    Photolithography is used to image bump and copper pillar patterns prior to electroplating, which requires photoresist chemistries that are formulated to image at tighter pitches.

  • DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. 点击这里 to view a short video of our comprehensive offerings.

Bump Plating 光阻

  • Dry Film 光阻 for WLP

    Dry Film 光阻 for WLP

    Wafer-level packaging dry-film photoresist solutions for 3DIC, 扇出, 碰撞, copper pillar and redistribution applications.