Semiconductor Packaging Materials

Bump Plating 光阻

概述产品

Liquid and Dry Film Resists for Advanced Packaging 应用程序

北京PK赛车网站电子 & Imaging offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s advanced wafer level packaging, 微机电系统, and 3D photolithography applications.

Designed to prevent metals from leaching into the photoresists, they are compatible with plating chemistries in a variety of metals including copper, 纯锡, 和镍. Our chemically-amplified and conventional formulations in both dry and liquid photoresist versions feature:

Excellent resolution for high aspect ratio
Excellent conformal properties
30-80 µm thickness coverage range
Easy removal after plating

Liquid Bump 光阻

Liquid photoresists are best suited to wafer-level processes. They are spin-coated, baked, exposed, developed, and then stripped.

产品系列:

Intervia™ BCPR-i 4500
皮普BPR™100

Dry Bump 光阻

Dry bump photoresists are suited to applications requiring thicker films. They are also better choice than liquid for panel-level packaging.

产品系列:

巨头系列
WBR和WB系列
MX系列

What is Bump Plating Photoresist?

Bump plating photoresist technology was developed to meet today’s requirement of tighter bump pitches for advanced wafer level packaging processes as the semiconductor industry moves from plating bumps to smaller pillars.

Photolithography is used to image bump and copper pillar patterns prior to electroplating, which requires photoresist chemistries that are formulated to image at tighter pitches.

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