北京PK赛车网站电子 & Imaging’s high-performing silicone die encapsulants help protect high-value microelectronics in demanding automotive, 通信, 和消费电子应用.
Formulated to tailor rheology for ease of application and low ionic impurities, these materials are designed to protect sensitive semiconductor devices with void-free application around complex packaging designs. They are compatible with commonly-used dispensing and screen printing techniques.
Our silicone die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free solder processing or stringent thermal stress-reliability testing conditions.
DuPont’s portfolio of silicone-based lid-seal adhesives are designed to handle the high functionality of today’s advanced packaging processes, delivering the performance needed for today’s high-performance computing, mobile and automotive electronic applications.查看详细信息
Ordinary die-attach adhesives suit ordinary chip applications. But when a chip design must deliver reliable performance in extreme temperatures, 高水分, or stressful environments look to 北京PK赛车网站电子 & 非凡的解决方案.查看详细信息
Our thermally conductive silicones are designed to handle the heat dissipation of today’s advanced electronic devices.查看详细信息
Photo-patternable dielectrics and non-photo-patternable adhesives make possible chip-to-wafer and wafer-to-wafer stacking for heterogeneous integration.查看详细信息