保护价值微电子

北京PK赛车网站电子 & Imaging’s high-performing silicone die encapsulants help protect high-value microelectronics in demanding automotive, 通信, 和消费电子应用.

Formulated to tailor rheology for ease of application and low ionic impurities, these materials are designed to protect sensitive semiconductor devices with void-free application around complex packaging designs. They are compatible with commonly-used dispensing and screen printing techniques.

他们的特点:

  • 低离子含量
  • 低水分
  • 加工过程中收缩最小
  • Low modulus for mechanical stress protection
  • Compatible with commonly-used dispensing and screen printing technique
 
 
 
  • As electronics are used in increasingly harsh environments, it’s more critical than ever to protect sensitive devices or components against thermal and mechanical stress.

  • DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. 点击这里 to view a short video of our comprehensive offerings.

半导体封装材料

  • 死密封剂

    死密封剂

    Our silicone die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free solder processing or stringent thermal stress-reliability testing conditions.

  • 盖子密封胶粘剂

    盖子密封胶粘剂

    DuPont’s portfolio of silicone-based lid-seal adhesives are designed to handle the high functionality of today’s advanced packaging processes, delivering the performance needed for today’s high-performance computing, mobile and automotive electronic applications.

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  • 死连接粘合剂

    死连接粘合剂

    Ordinary die-attach adhesives suit ordinary chip applications. But when a chip design must deliver reliable performance in extreme temperatures, 高水分, or stressful environments look to 北京PK赛车网站电子 & 非凡的解决方案.

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  • 热界面材料

    热界面材料

    Our thermally conductive silicones are designed to handle the heat dissipation of today’s advanced electronic devices.

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  • 永久结合电介质

    永久结合电介质

    Photo-patternable dielectrics and non-photo-patternable adhesives make possible chip-to-wafer and wafer-to-wafer stacking for heterogeneous integration.

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