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保护价值微电子
北京PK赛车网站电子 & Imaging’s high-performing silicone die encapsulants help protect high-value microelectronics in demanding automotive, 通信, 和消费电子应用.
Formulated to tailor rheology for ease of application and low ionic impurities, these materials are designed to protect sensitive semiconductor devices with void-free application around complex packaging designs. They are compatible with commonly-used dispensing and screen printing techniques.
他们的特点:
- 低离子含量
- 低水分
- 加工过程中收缩最小
- Low modulus for mechanical stress protection
- Compatible with commonly-used dispensing and screen printing technique
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为什么使用模具封装剂?
As electronics are used in increasingly harsh environments, it’s more critical than ever to protect sensitive devices or components against thermal and mechanical stress.
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我们的半导体组装产品组合
DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. 点击这里 to view a short video of our comprehensive offerings.
半导体封装材料
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死密封剂
死密封剂
Our silicone die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free solder processing or stringent thermal stress-reliability testing conditions.
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盖子密封胶粘剂
盖子密封胶粘剂
DuPont’s portfolio of silicone-based lid-seal adhesives are designed to handle the high functionality of today’s advanced packaging processes, delivering the performance needed for today’s high-performance computing, mobile and automotive electronic applications.
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死连接粘合剂
死连接粘合剂
Ordinary die-attach adhesives suit ordinary chip applications. But when a chip design must deliver reliable performance in extreme temperatures, 高水分, or stressful environments look to 北京PK赛车网站电子 & 非凡的解决方案.
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热界面材料
热界面材料
Our thermally conductive silicones are designed to handle the heat dissipation of today’s advanced electronic devices.
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永久结合电介质
永久结合电介质
Photo-patternable dielectrics and non-photo-patternable adhesives make possible chip-to-wafer and wafer-to-wafer stacking for heterogeneous integration.
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