电子元件

引线框架

 
 
 

引线框架完成

为IC和LED引线框饰面量身定制解决方案

DuPont offers customers many choices of metal finishes for leadframes depending on the demands of each application, 包括根据客户要求定制的合金. We provide a total manufacturing solution as a service to customers developing new leadframe package types. 我们的产品组合包括:

  • Plating with many different metals to suit all types of leadframe packages
  • Materials compatible with various types of plating equipment
  • Surface treatments to enhance performance of metal finishes

选择北京PK赛车网站作为您的材料解决方案合作伙伴:

  • 提高引线框封装的可靠性
  • 支持尖端的定制包装设计
  • 满足每个最终用例的需求
 
 
 
  • Metal leadframes appear inside a variety of IC package types, including a quad flat package (QFP) and quad flat no-leads package (QFN). Light-emitting diodes (LEDs) are also built in leadframe packages. 引线框架 require a variety of finishes depending on the package design and end application.

  • Two applications are driving demand for high-performing IC leadframes. 汽车电子工业正在迅速发展, with an ever-increasing number of components per vehicle. High-end consumer electronics continue to push the envelope on package dimensions.

    A higher level of device integration is driving the development of unique package designs and a trend toward packages with a higher number of I/O, 更好的推销, 和较小的足迹. 随着包装尺寸的缩小, leadframes become more critical for component reliability, 需要更复杂的表面处理.

    The silver-plated surface of LED leadframes requires a high-quality electrolytic finish to achieve the reliable wire bonding, 足够的亮度, 和高反射率. This is especially important for high-output LEDs in residential, 商业, 街道照明和汽车前灯.

电子元件