Metal leadframes appear inside a variety of IC package types, including a quad flat package (QFP) and quad flat no-leads package (QFN). Light-emitting diodes (LEDs) are also built in leadframe packages. 引线框架 require a variety of finishes depending on the package design and end application.

Two applications are driving demand for high-performing IC leadframes. 汽车电子工业正在迅速发展, with an ever-increasing number of components per vehicle. High-end consumer electronics continue to push the envelope on package dimensions.

A higher level of device integration is driving the development of unique package designs and a trend toward packages with a higher number of I/O, 更好的推销, 和较小的足迹. 随着包装尺寸的缩小, leadframes become more critical for component reliability, 需要更复杂的表面处理.

The silver-plated surface of LED leadframes requires a high-quality electrolytic finish to achieve the reliable wire bonding, 足够的亮度, 和高反射率. This is especially important for high-output LEDs in residential, 商业, 街道照明和汽车前灯.