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Metallization for Multi-layer Boards
Enabling high-performance rigid boards
北京PK赛车网站的金属化和成像产品是驻留在计算机中的高端多层pcb的关键使能技术, smartphones, and automobiles. 随着层数的增加，不能牺牲可靠性. 我们提供各种各样的产品，将使您的产品发挥其最佳性能. Materials include:
- 涂布材料使电介质膨胀，以便更有效地蚀刻
- 稳定的化学镀铜，确保提高通孔电镀覆盖
- 电解铜的直流电镀，以均匀填充高层数板的通孔
Choose DuPont as your materials solutions partner to:
- Enhance the reliability of your high-layer-count boards
- 创建易于使用的解决方案，简化PCB金属化过程
- 找到适合你的应用的最佳材料组合
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High Aspect Ratio Board Challenges
pcb的层数已经增加到蚀刻和沉积金属可以成为性能限制步骤的程度. Holes are narrower in diameter and deeper than ever before, making via preparation, coating, and filling critical. 高速、高频应用尤其敏感. 金属化需要根据介质材料和板的几何形状进行定制，以确保具有小特征尺寸的HAR板的可靠性能.
Metallization Materials for PCBs
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Multi-Layered Boards
Multi-Layered Boards
Metallization to enable high-performance rigid PCBs.
View Details一种用于水平模式的自加速化学铜浴, and can be used in either high or low build applicationsEliminating the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and qualityDesigned for use with periodic pulse reverse (PPR) plating适用于印刷电路板的可靠通孔电镀，适用于厚度可达约5mm的电路板，具有良好的表面分布，高速电镀, leveling and throwing powerDesigned to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceProviding enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses与Duraposit™化学镍浴和Aurolectroless™浸泡金浴结合使用，为pcb的最终整理提供均匀的ENEPIG镀层A wide range of supporting products for developing, 蚀刻和剥离工艺，补充我们的照片可成像产品Uniform thin coatings provide improved surface conformance, improved fine-line etching performance, as well as lower costs and reduced waste -
IC Substrates
IC Substrates
镀铜解决方案的基材在所有类型的先进封装.
View Details一种用于水平模式的自加速化学铜浴, and can be used in either high or low build applications高抛度化学镀铜系统，可在微孔中实现可靠覆盖，同时最大限度地减少表面铜沉积, thereby enhancing etching capability.Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performanceProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceProviding enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses为IC-Substrate PCB提供内芯层通孔填充，提高可靠性, and both electrical and thermal conductivity与Duraposit™化学镍浴和Aurolectroless™浸泡金浴结合使用，为pcb的最终整理提供均匀的ENEPIG镀层 -
High Density Interconnect
High Density Interconnect
我们的高度共形镀铜将使任何HDI设计表现良好.
View Details一种用于水平模式的自加速化学铜浴, and can be used in either high or low build applicationsDesigned to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance适用于印刷电路板的可靠通孔电镀，适用于厚度可达约5mm的电路板，具有良好的表面分布，高速电镀, leveling and throwing powerProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceProviding enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses为IC-Substrate PCB提供内芯层通孔填充，提高可靠性, and both electrical and thermal conductivityAn acidic tin plating solution which produces smooth, fine-grained deposits over a wide plating range -
Flexible Circuits
Flexible Circuits
Copper plating to meet the demands of flexible PCBs.
View Details一种用于水平模式的自加速化学铜浴, and can be used in either high or low build applicationsA copper plating process producing uniform, 在加速镀后，镀层具有高延展性和抗拉强度.Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance