Metallization For Printed Circuit Boards

Multi-Layered Boards

 
 
 

Metallization for Multi-layer Boards

Enabling high-performance rigid boards

北京PK赛车网站的金属化和成像产品是驻留在计算机中的高端多层pcb的关键使能技术, smartphones, and automobiles. 随着层数的增加,不能牺牲可靠性. 我们提供各种各样的产品,将使您的产品发挥其最佳性能. Materials include:

  • 涂布材料使电介质膨胀,以便更有效地蚀刻
  • 稳定的化学镀铜,确保提高通孔电镀覆盖
  • 电解铜的直流电镀,以均匀填充高层数板的通孔

Choose DuPont as your materials solutions partner to:

  • Enhance the reliability of your high-layer-count boards
  • 创建易于使用的解决方案,简化PCB金属化过程
  • 找到适合你的应用的最佳材料组合
 
 
 
  • pcb的层数已经增加到蚀刻和沉积金属可以成为性能限制步骤的程度. Holes are narrower in diameter and deeper than ever before, making via preparation, coating, and filling critical. 高速、高频应用尤其敏感. 金属化需要根据介质材料和板的几何形状进行定制,以确保具有小特征尺寸的HAR板的可靠性能.

Metallization Materials for PCBs