电子元件

无源设备

 
 
 

无源器件的电镀和抛光

Ensuring Reliable Connections for All 无源设备

DuPont brings decades of experience in plating and surface finishing to offer a total solution that is compatible with the latest generation of plating equipment and passive devices. When combined with expertise in thick film conductors and resistors from our Advanced Materials division, we offer all the materials needed to make reliable passive components.

We provide electronic-grade electrolytic nickel, 哑光锡, and electrolytic copper plating products that provide stable deposit compositions, 具有特殊的热阻, 附着力和可焊性. Our post-treatment materials ensure that metal plating will remain functional throughout device storage and manufacturing.

Choose DuPont as your materials solutions partner to:

  • Meet demanding surface finish reliability requirements
  • Enhance the assembly yield of the smallest passive devices
  • Work with you to provide a complete solution
 
 
 
  • 被动devices-resistors, 电容器, 电感器, and diodes—serve a necessary role in electronic circuits. 在电子元件的背景下, passive devices are small discrete chips rather than thin-film structures integrated directly into substrates. These chips are common as discrete components in system-in-package (SiP) configurations, where they are proliferating for a wide range of applications.

  • Dimensions of passive devices continue to decrease below 1mm so that more functionality can be packed into a smaller space. Smartphones, an application where size is critical, contain hundreds of discrete passive devices. Automotive electronics use somewhat larger chips but have much more stringent reliability requirements.

    Changes in the dimensions of passive devices and the materials from which they are made affects component handling and surface finish requirements. Metal plating must be compatible with the components and resistant to chemical attack.

无源设备

  • Copper Electroplating 产品 for 无源设备

    Copper Electroplating 产品 for 无源设备

    A range of electrolytic copper plating products designed for plating of passive devices

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  • Nickel Electroplating 产品 for 无源设备

    Nickel Electroplating 产品 for 无源设备

    Advanced electrolytic nickel plating products for 无源设备 that enhance corrosion resistance

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  • Tin and Tin-Alloy Electroplating 产品 for 无源设备

    Tin and Tin-Alloy Electroplating 产品 for 无源设备

    Leading electrolytic tin products that meet the needs of passive devices

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    Providing a pure tin deposit with excellent solderability for 无源设备