被动devices-resistors, 电容器, 电感器, and diodes—serve a necessary role in electronic circuits. 在电子元件的背景下, passive devices are small discrete chips rather than thin-film structures integrated directly into substrates. These chips are common as discrete components in system-in-package (SiP) configurations, where they are proliferating for a wide range of applications.

Dimensions of passive devices continue to decrease below 1mm so that more functionality can be packed into a smaller space. Smartphones, an application where size is critical, contain hundreds of discrete passive devices. Automotive electronics use somewhat larger chips but have much more stringent reliability requirements.

Changes in the dimensions of passive devices and the materials from which they are made affects component handling and surface finish requirements. Metal plating must be compatible with the components and resistant to chemical attack.