引线框架

High Speed 银 Electroplating 产品 for IC 引线框架

 
 
 

DuPont 电子解决方案 offers high purity electrolytic silver jet plating products for the IC leadframe market.

产品

银jet™ 220SE High Speed 银
Description: A semi-bright to bright silver plating product designed to operate in high-speed jet stream selective electroplating equipment to produce high purity silver electrodeposits suitable for semiconductor applications.

银jet™300SD高速银
Description: A high-speed pure silver product designed for jet plating applications. The deposits are either matte or bright dependent upon requirements and can readily be used on both copper alloy and nickel alloy substrates.

银jet™850高速银
Description: A matte to semi-bright silver plating product designed to operate in high-speed jet stream selective electroplating equipment to produce high purity silver electrodeposits suitable for semiconductor applications.