形象的™抛光垫

The Ikonic™ pad series for chemical mechanical planarization (CMP) is a breakthrough pad platform designed for multiple applications and advanced nodes. DuPont’s latest CMP polishing pad technology combines a range of pad hardness and varying levels of porosity with a pad surface that is easy to condition. The Ikonic™ pad platform is designed to improve wafer defectivity performance and improve removal rate, topography and cost of ownership.

  • The Ikonic™ 9000 series of polishing pads targets processes that require higher hardness pads. It designed to deliver an excellent compromise between improving defectivity performance and maintaining or increasing removal rate at the most advanced logic and memory technology nodes.

    好处:

    • Best available balance in tradeoffs to improve defectivity performance while maintaining removal rate
    • Excellent stability over pad lifetime even at lower conditioning aggressiveness compared to more conventional solutions.

    应用程序:

    •  Interlayer dielectric (ILD), copper bulk, tungsten

  • The Ikonic™ 4300 series of polishing pad targets processes that require higher hardness pads. It is designed for processes that require higher planarization and improved defectivity performance.

    好处:

    • Higher planarization efficiency
    • Improved defectivity performance

    应用程序:

    • STI /二氧化铈、氧化

  • The Ikonic™ 4200 series of polishing pad targets processes that require higher hardness pads. It is designed for higher removal rate, which can help reduce cost of ownership for customers by giving higher throughput and/or reducing slurry consumption volume.

    好处:

    • 较高的去除率
    • Easily conditioned pad surface

    应用程序:

    • STI/ceria, tungsten, copper bulk

  • The Ikonic™ 4100 series of polishing pad targets processes that require higher hardness pads. It is designed to deliver significantly improve defectivity performance  in the most advanced Logic and Memory technology nodes.

    好处:

    • Step-out defectivity performance
    • Improved balance in trade-offs associated with defectivity and removal rate stability over pad-life
    • Easily conditioned pad surface

    应用程序:

    • Shallow trench isolation (STI)/ceria, interlayer dielectric (ILD), copper bulk, tungsten

  • The Ikonic™ 3000 series of polishing pads targets processes that require medium hardness pads. It is designed to deliver step-out improvements in wafer defectivity performance and improved topography performance when compared to IC1000™ pads.

    好处:

    • Improved defectivity performance
    • Improved topography performance
    • Multiple configuration options
    • 长垫一生
    • Easily conditioned pad surface

    应用程序:

    • 铜散装

  • The Ikonic™ 2000 series of polishing pads targets processes that require lower hardness pads. It is designed to deliver step-out improvements in wafer defectivity performance, consistent and stable removal rates, 更长的衬垫寿命.

    好处:

    • Step-out defectivity performance
    • Multiple offerings to meet a range of performance requirements
    • 长垫一生
    • Easily conditioned pad surface

    应用程序:

    • 铜障碍,浅黄色

 
 
 
其他CMP应用程序

Our CMP pads cover a wide range of applications and technology nodes. To further explore DuPont CMP pads, see our overview of product families by application.